About Lyte
Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!
About the role
- We are seeking an experienced process lead engineer in the field of optical device packaging and assembly with a degree in Mechanical Engineering, Physics or a related field.
What you'll do
- Lead optical engine and system module assembly with automation and tooling designs to increase UPH & yield and reduce cost with both customized hardware and software development based on SPC and driveCp,Cpkimprovement.
- Support the device packagingRnDand NPI with mechanical design, drawing and thermal modelling.
- Support devicetestingautomation and data analysis automation/scripts or software development and implementation.
- Work withRnDto understand the device specs, particularly mechanical control outline, and assembly requirements andnegotiate between the incoming device MCO, mechanical design, and assembly process based on design improvement and/or experimental data from designed DOEs.
- Work withOSATs tosupport NPI and volume production contract manufacture with technical SOW drafting.
- Act as the technical project manager for owned projects.
- Provide DFM, DFR, and DFTinputs for HQRnDteams for device packaging and assembly.
- Keep proper documentation, and initiateECN andPCN when needed.
- Develop andtrackpackaging andassemblycomponentspecificationsas well as inventory.
- Audit/regularly visit our contract Manufacturers and suppliers then provide reports.
- Writetechnical reports and present results to internal and external stakeholders.
- Build and grow the Operation Process Team worldwide.
Required Qualifications
- Havea mechanicalengineerdegree with relevant experienceonoptical module and/or Lider assembly.
- Minimal requirement is a Master or Ph.D. degree with 3 years of relevant experience.
- Experience or knowledge of opticalsensors. optical device packaging process, or optical module assembly process.
- Experience with assembly process integration for process flow design and continue process improvement.
- Expertisemechanical drawingsusingSolidWork, mechanical simulation, and thermal simulation.
- Project management capability/experience isa must.
- Experience working with foundries, OSATs, assemblyhouses, PCBAfab, and contract manufacturers in process development and yield improvement is important.
- The abilityto work independently and take ownership of projects as well as collaboratively in cross-functional teamsis a must.
- A fastlearner isa must.
- Good workethics isa must
- Capableofkeeping company confidential information and IP is a must.
Preferred Qualifications
- Knowledge or work experience withPCBAis highly desirable.
- Former experience of microelectronic and optical devices packaging isdesired.
- Understanding Silicon Photonics is a plus.
- Experience with FMEA, failure analysis, and 8D report is highly desired.
- Supplier quality management experience is a plus.
- Knowledge of Lidar and relevant technologies is a plus.
- Former experience of writing technical SoW is a plus.
- Familiar with ECN,PCN,and documentationishighly desirable.
Benefits
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- 401(k) retirement plan
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
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